Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Abstract Subsurface damage that is caused by mechanical machining a major impediment to the widespread use of hard–brittle materials. Ultrasonic vibration-assisted macro- or micromachining could facilitate shallow subsurface compared with conventional machining. However, was induced ultrasonic nanomachining on silicon crystal has not yet been thoroughly investigated. In this study, we used tip-based nanoscratch approach machine nanochannels single-crystal silicon, investigate mechanism material during ductile The removal state, morphology, and dimensions nanochannel, effect scratch outcomes were studied. materials expelled in rubbing, plowing, cutting mode sequence an increasing applied normal load, significantly harder than pristine after plastic deformation. Transmission electron microscope analysis demonstrated nanoscratching led larger static scratching. transmission microscopy results agreed Raman spectroscopy molecular dynamic simulation. Our findings are important for instructing at nanoscale level.